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| Thermal requirements must be addressed at the beginning of the design cycle in today's high-performance embedded systems. Using thermal simulation can provide engineers with a key tool to reduce design time and the number of re-spins. Perhaps even more importantly, making good use of these tools enables designers to predict and plan for failures - reducing design risks and improving reliability for mission-critical applications. |
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Thermal Simulation & Air Flow Design |
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Thermal simulation is another core competence of Advantech. We make FLOTHERM our standard thermal simulation tool. FLOTHERM is a powerful 3D computational fluid dynamics software that predicts airflow and heat transfer in and around electronic equipment, including the coupled effects of conduction, convection and radiation. Experience the benefits of using FLOTHERM for thermal design of electronics:
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Solving thermal problems before hardware is built |
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Reducing design re-spins and product unit costs |
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Improving reliability and overall engineering design |
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Feasibility Study |
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| To assure long-term quality, reduce trial and error, and save cost, Advantech has been using FloTHERM for our thermal
simulation tool. By accurately simulating conditions for thermal requirements, reliability, low noise requirements, size and weight limits can be carefully controlled. FloTHERM produces valuable feasibility studies before prototypes are built and helps with optimized parts placement, fan and heatsink solutions, thermal interface materials, air flow and venting location design. |
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Heat Sink Design |
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| Heat sinks are vital for transferring heat. The heat sink is usually made of bronze or aluminum, materials that can easily dissipate heat. This kind of heat sink is widely used and serves as a cooler for the CPU or the entire computer. It usually has a fin-shaped design to maximize the surface area and speed up the heat transfer. Advantech has professional heat sink design capability to ensure effective system heat dissipation. |
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